Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 065673/0685 | |
| Pages: | 8 |
| | Recorded: | 10/16/2023 | | |
Attorney Dkt #: | 392739-00007 |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE THE ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 053102 FRAME: 0585. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/15/2020
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Application #:
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15615693
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Filing Dt:
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06/06/2017
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Publication #:
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Pub Dt:
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09/21/2017
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Title:
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Semiconductor Device and Method of Forming Embedded Wafer Level Chip Scale Packages
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Assignee
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5 YISHUN STREET 23 |
SINGAPORE, SINGAPORE |
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Correspondence name and address
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KATTEN MUCHIN ROSENMAN LLP
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1919 PENNSYLVANIA AVE., NW - SUITE 800
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WASHINGTON, DC 20006
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06/05/2024 05:45 PM
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