Patent Assignment Details
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| Reel/Frame: | 016002/0686 | |
| Pages: | 5 |
| | Recorded: | 04/04/2005 | | |
| Attorney Dkt #: | YOR920040211US1(8728-696) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/29/2008
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Application #:
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10994494
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Filing Dt:
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11/20/2004
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Publication #:
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Pub Dt:
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05/25/2006
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Title:
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METHODS FOR FORMING CO-PLANAR WAFER-SCALE CHIP PACKAGES
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Correspondence name and address
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FRANK CHAU, ESQ.
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F. CHAU & ASSOCIATES, LLC
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130 WOODBURY ROAD
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WOODBURY, NY 11797
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