Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 032239/0686 | |
| Pages: | 3 |
| | Recorded: | 02/11/2014 | | |
| Attorney Dkt #: | MERGER - WIRELESS |
| Conveyance: | MERGER (SEE DOCUMENT FOR DETAILS). |
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Total properties:
8
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Patent #:
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Issue Dt:
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04/25/2006
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Application #:
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10769935
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Filing Dt:
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02/02/2004
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Publication #:
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Pub Dt:
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08/04/2005
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Title:
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AIRDOME ENCLOSURE FOR COMPONENTS
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Patent #:
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Issue Dt:
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07/03/2007
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Application #:
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10841752
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Filing Dt:
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05/06/2004
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Publication #:
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Pub Dt:
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11/10/2005
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Title:
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MULTI-MODE INTEGRATED CIRCUIT STRUCTURE
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Patent #:
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Issue Dt:
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04/04/2006
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Application #:
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10905796
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Filing Dt:
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01/20/2005
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Publication #:
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Pub Dt:
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05/12/2005
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Title:
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HIGH EFFICIENCY POWER AMPLIFIER
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Patent #:
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Issue Dt:
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08/07/2007
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Application #:
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10982009
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Filing Dt:
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11/05/2004
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Publication #:
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Pub Dt:
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05/11/2006
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Title:
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TEMPERATURE-COMPENSATED RESISTOR AND FABRICATION METHOD THEREFOR
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Patent #:
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Issue Dt:
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05/23/2006
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Application #:
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11036162
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Filing Dt:
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01/14/2005
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Publication #:
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Pub Dt:
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06/09/2005
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Title:
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HIGH EFFICIENCY POWER AMPLIFIER WITH MULTIPLE POWER MODES
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Patent #:
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Issue Dt:
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06/19/2007
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Application #:
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11165865
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Filing Dt:
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06/24/2005
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Publication #:
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Pub Dt:
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11/10/2005
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Title:
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MULTI-MODE INTEGRATED CIRCUIT STRUCTURE
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Patent #:
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Issue Dt:
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05/08/2007
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Application #:
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11396297
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Filing Dt:
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03/31/2006
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Publication #:
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Pub Dt:
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11/23/2006
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Title:
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HIGH EFFICIENCY POWER AMPLIFIER
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Patent #:
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Issue Dt:
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07/12/2011
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Application #:
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12112652
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Filing Dt:
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04/30/2008
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Publication #:
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Pub Dt:
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11/05/2009
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Title:
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PLANAR PACKAGELESS SEMICONDUCTOR STRUCTURE WITH VIA AND COPLANAR CONTACTS
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Assignee
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| NO. 1 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768923 |
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Correspondence name and address
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KATHY MANKE
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4380 ZIEGLER ROAD
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FORT COLLINS, CO 80525
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