Patent Assignment Details
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| Reel/Frame: | 037240/0686 | |
| Pages: | 3 |
| | Recorded: | 12/08/2015 | | |
| Attorney Dkt #: | APPM/20921USP |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/29/2020
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Application #:
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14896854
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Filing Dt:
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12/08/2015
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Publication #:
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Pub Dt:
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05/12/2016
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Title:
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METHOD FOR COPPER PLATING THROUGH SILICON VIAS USING WET WAFER BACK CONTACT
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Assignee
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| 3050 BOWERS AVENUE |
| SANTA CLARA, CALIFORNIA 95054 |
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Correspondence name and address
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PATTERSON & SHERIDAN, LLP - - APPLIED MA
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24 GREENWAY PLAZA, SUITE 1600
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HOUSTON, TX 77046
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05/29/2024 02:25 PM
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