Patent Assignment Details
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Reel/Frame: | 060497/0687 | |
| Pages: | 6 |
| | Recorded: | 07/13/2022 | | |
Attorney Dkt #: | 21728.060US-PAT |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/28/2023
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Application #:
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17841627
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Filing Dt:
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06/15/2022
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Publication #:
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Pub Dt:
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01/05/2023
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Title:
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STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON VIA (TSV) VERTICAL INTERCONNECTS
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Assignee
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7855 SOUTH RIVER PARKWAY, STE. 205 |
TEMPE, ARIZONA 85284 |
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Correspondence name and address
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CHANTAL OWENS
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1255 W. RIO SALADO PKWY., STE. 215
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TEMPE, AZ 85281
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06/14/2024 08:57 AM
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