Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 025176/0690 | |
| Pages: | 4 |
| | Recorded: | 10/21/2010 | | |
| Attorney Dkt #: | 1938.1239 |
| Conveyance: | CORRECTIVE COVER SHEET TO CORRECT THE FIRST INVENTOR'S NAME TO SPECIFY JUNG HYUN PARK ON ASSIGNMENT PREVIOUSLY RECORDED ON REEL 024958 FRAME 0541. |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/01/2013
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Application #:
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12923037
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Filing Dt:
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08/30/2010
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Publication #:
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Pub Dt:
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04/28/2011
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Title:
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Ball grid array substrate with insulating layer and semiconductor chip package
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Assignee
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| 314 MAETAN 3-DONG |
| YEONGTONG-GU, SUWON-SI |
| GYEONGGI-DO 443-743, KOREA, REPUBLIC OF |
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Correspondence name and address
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STAAS & HALSEY LLP
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ATTENTION: DAVID M. PITCHER
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1201 NEW YORK AVE., N.W., 7TH FLOOR
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WASHINGTON, D.C. 20005
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