Patent Assignment Details
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Reel/Frame: | 032327/0693 | |
| Pages: | 6 |
| | Recorded: | 02/28/2014 | | |
Attorney Dkt #: | 040506-0052 |
Conveyance: | RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). |
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Total properties:
4
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Patent #:
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Issue Dt:
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11/27/2012
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Application #:
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10525824
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Filing Dt:
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01/17/2008
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Publication #:
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Pub Dt:
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06/12/2008
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Title:
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SYSTEM FOR CONTINUOUS GROWING OF MONOCRYSTALLINE SILICON
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Patent #:
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Issue Dt:
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12/22/2009
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Application #:
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10789638
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Filing Dt:
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02/27/2004
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Publication #:
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Pub Dt:
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05/05/2005
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Title:
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SYSTEM FOR CONTINUOUS GROWING OF MONOCRYSTALLINE SILICON
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Patent #:
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Issue Dt:
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11/13/2007
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Application #:
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10918681
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Filing Dt:
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08/13/2004
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Title:
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FORMATION OF A SILICON SHEET BY COLD SURFACE CASTING
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Patent #:
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Issue Dt:
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04/11/2006
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Application #:
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11089725
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Filing Dt:
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03/24/2005
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Publication #:
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Pub Dt:
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10/06/2005
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Title:
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METHOD AND APPARATUS FOR CUTTING ULTRA THIN SILICON WAFERS
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Assignee
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7832 N. LEADBETTER ROAD |
PORTLAND, OREGON 97203 |
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Correspondence name and address
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ZEYNEP GIESEKE
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233 S. WACKER DRIVE, SUITE 5800
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C/O LATHAM & WATKINS LLP
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CHICAGO, IL 60606
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