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Patent Assignment Details
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Reel/Frame:032327/0693   Pages: 6
Recorded: 02/28/2014
Attorney Dkt #:040506-0052
Conveyance: RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
Total properties: 4
1
Patent #:
Issue Dt:
11/27/2012
Application #:
10525824
Filing Dt:
01/17/2008
Publication #:
Pub Dt:
06/12/2008
Title:
SYSTEM FOR CONTINUOUS GROWING OF MONOCRYSTALLINE SILICON
2
Patent #:
Issue Dt:
12/22/2009
Application #:
10789638
Filing Dt:
02/27/2004
Publication #:
Pub Dt:
05/05/2005
Title:
SYSTEM FOR CONTINUOUS GROWING OF MONOCRYSTALLINE SILICON
3
Patent #:
Issue Dt:
11/13/2007
Application #:
10918681
Filing Dt:
08/13/2004
Title:
FORMATION OF A SILICON SHEET BY COLD SURFACE CASTING
4
Patent #:
Issue Dt:
04/11/2006
Application #:
11089725
Filing Dt:
03/24/2005
Publication #:
Pub Dt:
10/06/2005
Title:
METHOD AND APPARATUS FOR CUTTING ULTRA THIN SILICON WAFERS
Assignor
1
Exec Dt:
02/26/2014
Assignee
1
7832 N. LEADBETTER ROAD
PORTLAND, OREGON 97203
Correspondence name and address
ZEYNEP GIESEKE
233 S. WACKER DRIVE, SUITE 5800
C/O LATHAM & WATKINS LLP
CHICAGO, IL 60606

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