Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 027225/0694 | |
| Pages: | 3 |
| | Recorded: | 11/15/2011 | | |
| Attorney Dkt #: | 38323-US-PA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/01/2013
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Application #:
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13294183
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Filing Dt:
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11/11/2011
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Publication #:
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Pub Dt:
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03/14/2013
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Title:
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ELECTRICAL TEST STRUCTURE APPLYING 3D-ICS BONDING TECHNOLOGY FOR STACKING ERROR MEASUREMENT
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Assignee
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| NO. 1001, DASYUE RD., |
| HSINCHU CITY, TAIWAN 300 |
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Correspondence name and address
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JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE
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7F.-1, NO. 100, ROOSEVELT RD., SEC. 2,
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TAIPEI, 100 TAIWAN
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