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Reel/Frame:021677/0695   Pages: 5
Recorded: 10/14/2008
Attorney Dkt #:00 4469 US1
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
02/08/2011
Application #:
12297022
Filing Dt:
10/14/2008
Publication #:
Pub Dt:
06/25/2009
Title:
METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY; AN ELECTRONIC ASSEMBLY, A COVER AND A SUBSTRATE
Assignors
1
Exec Dt:
05/24/2007
2
Exec Dt:
05/24/2007
3
Exec Dt:
06/11/2007
4
Exec Dt:
10/14/2008
Assignee
1
HIGH TECH CAMPUS 60
EINDHVOEN, NETHERLANDS 5656 AG
Correspondence name and address
NXP, B.V. NXP INTELLECTUAL PROPERTY DEPA
M/S41-SJ
1109 MCKAY DRIVE
SAN JOSE, CA 95131

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