Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 056503/0697 | |
| Pages: | 10 |
| | Recorded: | 06/10/2021 | | |
| Attorney Dkt #: | COU-034~037 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
4
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Patent #:
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Issue Dt:
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08/07/2012
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Application #:
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12232847
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Filing Dt:
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09/25/2008
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Publication #:
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Pub Dt:
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03/25/2010
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Title:
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SUBSTRATE STRUCTURE WITH DIE EMBEDDED INSIDE AND DUAL BUILD-UP LAYERS OVER BOTH SIDE SURFACES AND METHOD OF THE SAME
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Patent #:
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Issue Dt:
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08/07/2012
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Application #:
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13093226
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Filing Dt:
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04/25/2011
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Publication #:
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Pub Dt:
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08/11/2011
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Title:
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STACKING PACKAGE STRUCTURE WITH CHIP EMBEDDED INSIDE AND DIE HAVING THROUGH SILICON VIA AND METHOD OF THE SAME
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Patent #:
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Issue Dt:
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07/31/2012
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Application #:
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13289864
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Filing Dt:
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11/04/2011
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Publication #:
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Pub Dt:
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02/23/2012
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Title:
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IMAGE SENSOR PACKAGE WITH DUAL SUBSTRATES AND THE METHOD OF THE SAME
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Patent #:
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Issue Dt:
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06/28/2016
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Application #:
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14223157
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Filing Dt:
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03/24/2014
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Publication #:
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Pub Dt:
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09/24/2015
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Title:
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SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF THE SAME
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Assignee
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| 1272 SUNRISE WAY |
| MILPITAS, CALIFORNIA 95035 |
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Correspondence name and address
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YEN JUNG SUNG
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3047 37ST
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ASTORIA, NY 11103
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