Patent Assignment Details
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Reel/Frame: | 027538/0699 | |
| Pages: | 2 |
| | Recorded: | 01/16/2012 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13348503
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Filing Dt:
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01/11/2012
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Publication #:
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Pub Dt:
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07/11/2013
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Title:
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THERMAL COMPRESSION HEAD FOR FLIP CHIP BONDING
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Assignee
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NO. 26, CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE |
KAOHSIUNG, TAIWAN 811 |
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Correspondence name and address
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GEORGE D. MORGAN
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4635 S. LAKESHORE DR., SUITE 131
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TEMPE, AZ 85282
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