Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 037552/0700 | |
| Pages: | 4 |
| | Recorded: | 01/21/2016 | | |
| Attorney Dkt #: | 0941-3200PUS4 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/31/2017
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Application #:
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15003150
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Filing Dt:
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01/21/2016
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Publication #:
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Pub Dt:
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01/05/2017
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Title:
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CHIP PACKAGE HAVING DIE STRUCTURES OF DIFFERENT HEIGHTS AND METHOD OF FORMING SAME
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Assignee
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| NO. 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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BIRCH STEWART KOLASCH & BIRCH, LLP
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P.O. BOX 747
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FALLS CHURCH, VA 22042-0747
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