Patent Assignment Details
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| Reel/Frame: | 058747/0701 | |
| Pages: | 3 |
| | Recorded: | 01/24/2022 | | |
| Attorney Dkt #: | 233.2265.US.UTL |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/04/2023
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Application #:
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17625746
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Filing Dt:
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01/08/2022
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Publication #:
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Pub Dt:
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02/02/2023
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Title:
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Method For Disposal Of Waste Printed Circuit Board Thermal Cracking Slag And Smelting Soot
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Assignee
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| 100 PINGLEYUAN, CHAOYANG DISTRICT |
| BEIJING, CHINA 100124 |
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Correspondence name and address
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CASCADIA INTELLECTUAL PROPERTY
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12360 LAKE CITY WAY NE
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SUITE 501
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SEATTLE, WA 98125
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06/04/2024 10:12 AM
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