Patent Assignment Details
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| Reel/Frame: | 025123/0702 | |
| Pages: | 4 |
| | Recorded: | 10/08/2010 | | |
| Attorney Dkt #: | 18865K-030600US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/18/2011
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Application #:
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12277699
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Filing Dt:
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11/25/2008
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Publication #:
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Pub Dt:
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06/04/2009
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Title:
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SEMICONDUCTOR POWER MODULE PACKAGE WITH TEMPERATURE SENSOR MOUNTED THEREON AND METHOD OF FABRICATING THE SAME
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Assignee
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| 82-3, DODANG-DONG, WONMI-KU |
| PUCHON, KYUNGKI-DO, SOUTH, KOREA, REPUBLIC OF |
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Correspondence name and address
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ADAM J. PYONIN
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TOWNSEND AND TOWNSEND AND CREW LLP
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TWO EMBARCADERO CENTER
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EIGHTH FLOOR
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SAN FRANCISCO, CALIFORNIA 94111-3834
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