Patent Assignment Details
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| Reel/Frame: | 032267/0702 | |
| Pages: | 14 |
| | Recorded: | 02/21/2014 | | |
| Attorney Dkt #: | ORA14-0235-CIP |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/29/2016
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Application #:
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14047978
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Filing Dt:
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10/07/2013
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Publication #:
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Pub Dt:
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10/30/2014
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Title:
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HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE WITH AN INTERPOSER
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Assignee
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| 500 ORACLE PARKWAY |
| MAIL STOP 5OP7 |
| REDWOOD CITY, CALIFORNIA 94065 |
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Correspondence name and address
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A. RICHARD PARK
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PARK, VAUGHAN, FLEMING & DOWLER LLP
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2820 FIFTH STREET
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DAVIS, CA 95618
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