Total properties:
115
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Patent #:
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Issue Dt:
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09/17/2002
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Application #:
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09705223
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Filing Dt:
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11/02/2000
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Title:
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HIGH MOLECULAR WEIGHT EPOXY RESIN AND RESINOUS COMPOSITION FOR PRINTED CIRCUIT BOARD
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Patent #:
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Issue Dt:
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11/25/2003
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Application #:
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09733290
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Filing Dt:
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12/08/2000
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Publication #:
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Pub Dt:
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08/15/2002
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Title:
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WATER DISPERSIBLE EPOXY RESINS
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Patent #:
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Issue Dt:
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02/04/2003
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Application #:
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09784624
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Filing Dt:
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02/15/2001
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Publication #:
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Pub Dt:
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10/18/2001
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Title:
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COMPOSITION OF EPOXY RESIN AND TRIAZINE-FORMALDEHYDE-PHENOL RESIN
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Patent #:
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Issue Dt:
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06/14/2005
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Application #:
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10091086
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Filing Dt:
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03/05/2002
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Publication #:
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Pub Dt:
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09/11/2003
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Title:
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ATTACHMENT OF SURFACE MOUNT DEVICES TO PRINTED CIRCUIT BOARDS USING A THERMOPLASTIC ADHESIVE
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10091262
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Filing Dt:
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03/05/2002
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Publication #:
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Pub Dt:
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09/11/2003
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Title:
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Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive
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Patent #:
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Issue Dt:
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01/13/2004
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Application #:
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10145829
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Filing Dt:
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05/14/2002
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Publication #:
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Pub Dt:
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03/06/2003
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Title:
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MODIFIED EPOXY RESIN COMPOSITION, PRODUCTION PROCESS FOR THE SAME AND SOLVENT-FREE COATING COMPRISING THE SAME
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Patent #:
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Issue Dt:
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06/29/2004
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Application #:
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10219681
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Filing Dt:
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08/15/2002
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Publication #:
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Pub Dt:
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01/02/2003
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Title:
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GLYCIDYL ESTER OF COOH POLYESTER AND CURING AGENT
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10250605
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Filing Dt:
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07/07/2003
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Publication #:
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Pub Dt:
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03/11/2004
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Title:
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Epoxy resin composition for semiconductor encapsulation
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Patent #:
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Issue Dt:
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04/19/2005
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Application #:
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10250612
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Filing Dt:
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07/07/2003
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Publication #:
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Pub Dt:
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03/18/2004
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Title:
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CURING AGENT FOR EPOXY RESINS AND EPOXY RESIN COMPOSITION
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10349673
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Filing Dt:
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01/23/2003
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Publication #:
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Pub Dt:
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07/29/2004
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Title:
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Epoxy resin compositions, methods of preparing, and articles made therefrom
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Patent #:
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Issue Dt:
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02/21/2006
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Application #:
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10351903
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Filing Dt:
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01/27/2003
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Publication #:
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Pub Dt:
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07/29/2004
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Title:
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EPOXY RESIN CURING COMPOSITIONS AND RESIN COMPOSITIONS INCLUDING SAME
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Patent #:
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Issue Dt:
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04/15/2008
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Application #:
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10487318
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Filing Dt:
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07/12/2004
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Publication #:
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Pub Dt:
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12/02/2004
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Title:
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EPOXY RESIN CURING AGENT OF EPOXY RESIN-LIQUID AMINE ADDUCT AND POLYAMIDOAMINE
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Patent #:
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Issue Dt:
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09/22/2009
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Application #:
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10667648
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Filing Dt:
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09/22/2003
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Publication #:
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Pub Dt:
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03/24/2005
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Title:
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EPOXY RESIN COMPOSITIONS, PROCESSES UTILIZING SAME AND ARTICLES MADE THEREFROM
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Patent #:
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Issue Dt:
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10/18/2005
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Application #:
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10671224
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Filing Dt:
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09/24/2003
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Publication #:
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Pub Dt:
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04/01/2004
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Title:
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WATER DISPERSIBLE EPOXY RESINS
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Patent #:
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Issue Dt:
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06/07/2005
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Application #:
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10840115
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Filing Dt:
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05/05/2004
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Publication #:
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Pub Dt:
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12/16/2004
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Title:
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PROCESS FOR THE MANUFACTURE OF GLYCIDYLESTER COMPOSITIONS
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