Patent Assignment Details
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| Reel/Frame: | 018609/0704 | |
| Pages: | 3 |
| | Recorded: | 11/21/2006 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11602736
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Filing Dt:
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11/21/2006
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Publication #:
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Pub Dt:
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05/22/2008
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Title:
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System and method for solder bump plating
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Assignee
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| 1011 PAWTUCKET BOULEVARD |
| LOWELL, MASSACHUSETTS 01854 |
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Correspondence name and address
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BRIAN C. OAKES, ESQUIRE
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TYCO TECHNOLOGY RESOURCES
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4550 NEW LINDEN HILL ROAD
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SUITE 140
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WILMINGTON, DE 19808-2952
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