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Patent Assignment Details
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Reel/Frame:059206/0706   Pages: 4
Recorded: 02/21/2022
Attorney Dkt #:2020A0193US1;2020A0285US1
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 2
1
Patent #:
Issue Dt:
10/31/2023
Application #:
17151654
Filing Dt:
01/18/2021
Publication #:
Pub Dt:
07/21/2022
Title:
System For Protecting MEMS Product Under ESD Event
2
Patent #:
Issue Dt:
01/30/2024
Application #:
17186011
Filing Dt:
02/26/2021
Publication #:
Pub Dt:
04/28/2022
Title:
ELECTRICAL INTERCONNECTION STRUCTURE, ELECTRONIC APPARATUS AND MANUFACTURING METHODS FOR THE SAME
Assignor
1
Exec Dt:
02/18/2022
Assignee
1
22 TAMPINES INDUSTRIAL CRESCENT #03-01, SINGAPORE 528607
SINGAPORE, SINGAPORE
Correspondence name and address
MICHAEL WIERSCH
2401 RIPPEY RD
LOOMIS, CA 95650

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