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Reel/Frame:019950/0709   Pages: 3
Recorded: 10/11/2007
Attorney Dkt #:MEGA 07-011US-TW06015-E07
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
11865059
Filing Dt:
09/30/2007
Publication #:
Pub Dt:
04/03/2008
Title:
INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL
Assignors
1
Exec Dt:
10/09/2007
2
Exec Dt:
10/09/2007
3
Exec Dt:
10/09/2007
Assignee
1
ROOM 301/302,NO.47, PARK 2ND RD., SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN 300
Correspondence name and address
JOHN CHEN
ROOM303, 3F.,NO.25,SEC.1,CHANG-AN E.ROAD
TAIPEI, 10441 TAIWAN

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