Total properties:
12
|
|
Patent #:
|
|
Issue Dt:
|
07/15/2003
|
Application #:
|
09695672
|
Filing Dt:
|
10/24/2000
|
Title:
|
SURFACE ACOUSTIC WAVE FILTER HAVING DIMINISHED BANDWIDTH AND METHOD OF OPERATING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
12/17/2002
|
Application #:
|
09755018
|
Filing Dt:
|
01/05/2001
|
Title:
|
WAFER-SCALE PACKAGE FOR SURFACE ACOUSTIC WAVE CIRCUIT AND METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
05/11/2004
|
Application #:
|
09755980
|
Filing Dt:
|
01/05/2001
|
Title:
|
SYSTEM AND METHOD FOR DISSIPATING STATIC CHARGE GENERATED IN A SURFACE ACOUSTIC WAVE DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
06/17/2003
|
Application #:
|
09755992
|
Filing Dt:
|
01/05/2001
|
Publication #:
|
|
Pub Dt:
|
07/11/2002
| | | | |
Title:
|
SYSTEM AND METHOD FOR DISSIPATING STATIC CHARGE GENERATED IN A SURFACE ACOUSTIC WAVE DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
11/18/2003
|
Application #:
|
09821592
|
Filing Dt:
|
03/29/2001
|
Publication #:
|
|
Pub Dt:
|
10/03/2002
| | | | |
Title:
|
WAFER-SCALE PACKAGE FOR SURFACE ACOUSTIC WAVE CIRCUIT AND METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
01/14/2003
|
Application #:
|
09997860
|
Filing Dt:
|
11/29/2001
|
Title:
|
HERMETIC PACKAGE FOR PYROELECTRIC-SENSITIVE ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
09/16/2003
|
Application #:
|
09997971
|
Filing Dt:
|
11/29/2001
|
Title:
|
HERMETIC PACKAGE FOR SURFACE ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
11/18/2003
|
Application #:
|
09998368
|
Filing Dt:
|
11/29/2001
|
Title:
|
HERMETIC PACKAGE FOR MULTIPLE CONTACT-SENSITIVE ELECTRONIC DEVICES AND METHODS OF MANUFACTURING THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
10/28/2003
|
Application #:
|
10003157
|
Filing Dt:
|
04/23/2002
|
Title:
|
HERMETIC PACKAGE FOR SURFACE ACOUSTIC WAVE DEVICE HAVING EXPOSED DEVICE SUBSTRATE CONTACTS AND METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
06/01/2004
|
Application #:
|
10271392
|
Filing Dt:
|
10/15/2002
|
Title:
|
WAFER-SCALE PACKAGE FOR SURFACE ACOUSTIC WAVE CIRCUIT AND METHOD OF MANUFACTURING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
11/27/2007
|
Application #:
|
10288529
|
Filing Dt:
|
11/05/2002
|
Publication #:
|
|
Pub Dt:
|
05/06/2004
| | | | |
Title:
|
METHOD FOR FORMING A MULTI-FREQUENCY SURFACE ACOUSTIC WAVE DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
02/23/2010
|
Application #:
|
11986788
|
Filing Dt:
|
11/26/2007
|
Publication #:
|
|
Pub Dt:
|
09/18/2008
| | | | |
Title:
|
METHOD FOR FORMING A MULTI-FREQUENCY SURFACE ACOUSTIC WAVE DEVICE
|
|