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Patent Assignment Details
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Reel/Frame:007567/0712   Pages: 4
Recorded: 07/14/1995
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
08/05/1997
Application #:
08466649
Filing Dt:
06/06/1995
Title:
NOVEL LANDING PAD TECHNOLOGY DOUBLED UP AS LOCAL INTERCONNECT AND BORDERLESS CONTACT FOR DEEP SUB-HALF MICROMETER IC APPLICATION
Assignors
1
Exec Dt:
06/05/1995
2
Exec Dt:
06/05/1995
3
Exec Dt:
06/05/1995
4
Exec Dt:
06/05/1995
Assignee
1
ONE AMD PLACE, M/S 68
SUNNYVALE, CALIFORNIA 94088
Correspondence name and address
BENMAN COLLINS & SAWYER
DAVID W. COLLINS
711 WEST LOS ALTOS ROAD
TUCSON, AZ 85704-4105

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