Patent Assignment Details
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| Reel/Frame: | 034736/0712 | |
| Pages: | 3 |
| | Recorded: | 01/16/2015 | | |
| Attorney Dkt #: | S279.0016US1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/13/2018
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Application #:
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14598679
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Filing Dt:
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01/16/2015
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Publication #:
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Pub Dt:
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07/30/2015
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Title:
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PACKAGE ASSEMBLY HAVING INTERCONNECT FOR STACKED ELECTRONIC DEVICES AND METHOD FOR MANUFACTURING THE SAME
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Assignee
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| A1501, TECHNOLOGY MANSION, EASTERN SOFTWARE PARK, NO. 90, WENSAN ROAD, ZHEJIANG PROVINCE |
| HANGZHOU, CHINA 310012 |
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Correspondence name and address
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JUDSON K. CHAMPLIN
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900 SECOND AVENUE SOUTH
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SUITE 1400
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MINNEAPOLIS, MN 55402
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