Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 032042/0713 | |
| Pages: | 2 |
| | Recorded: | 01/24/2014 | | |
| Attorney Dkt #: | 92,000-366 (PA-1108) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/22/2015
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Application #:
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14163569
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Filing Dt:
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01/24/2014
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Publication #:
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Pub Dt:
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07/31/2014
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Title:
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CHIP PACKAGE WITH IMPROVED HEAT DISSIPATION AND MANUFACTURING METHOD THEREOF
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Assignee
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| 5F, NO. 5, INNOVATION ROAD I |
| HSINCHU SCIENCE PARK |
| HSIN-CHU, TAIWAN |
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Correspondence name and address
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TUNG & ASSOCIATES / RANDY W. TUNG, ESQ.
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838 W. LONG LAKE RD.
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SUITE 120
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BLOOMFIELD HILLS, MI 48302
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