Patent Assignment Details
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Reel/Frame: | 036627/0713 | |
| Pages: | 5 |
| | Recorded: | 09/23/2015 | | |
Attorney Dkt #: | 55059-US-PA |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/08/2017
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Application #:
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14856546
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Filing Dt:
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09/16/2015
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Publication #:
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Pub Dt:
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10/27/2016
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Title:
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MULTI-CHIP PACKAGE STRUCTURE, WAFER LEVEL CHIP PACKAGE STRUCTURE AND MANUFACTURING PROCESS THEREOF
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Assignees
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NO. 1, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN |
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CANON'S COURT , 22 VICTORIA STREET , |
HAMILTON, BERMUDA HM12 |
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Correspondence name and address
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JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE
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7F.-1, NO. 100, ROOSEVELT RD., SEC. 2,
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TAIPEI, 100 TAIWAN
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