Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 050940/0714 | |
| Pages: | 6 |
| | Recorded: | 11/07/2019 | | |
| Attorney Dkt #: | P201806160US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/17/2021
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Application #:
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16675437
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Filing Dt:
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11/06/2019
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Publication #:
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Pub Dt:
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05/06/2021
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Title:
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MULTI-CHIP PACKAGE STRUCTURES HAVING EMBEDDED CHIP INTERCONNECT BRIDGES AND FAN-OUT REDISTRIBUTION LAYERS
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Assignee
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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Correspondence name and address
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FRANK V. DEROSA
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48 SOUTH SERVICE ROAD, SUITE 100
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RYAN, MASON & LEWIS, LLP
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MELVILLE, NY 11747
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