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Total properties:
13
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Patent #:
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Issue Dt:
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02/09/2021
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Application #:
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15916263
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Filing Dt:
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03/08/2018
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Publication #:
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Pub Dt:
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09/20/2018
| | | | |
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Title:
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METHOD FOR DEBONDING TEMPORARILY ADHESIVE-BONDED CARRIER-WORKPIECE PAIR BY USING CHEMICAL AND MECHANICAL MEANS
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Patent #:
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Issue Dt:
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02/19/2019
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Application #:
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15916265
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Filing Dt:
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03/08/2018
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Publication #:
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Pub Dt:
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09/20/2018
| | | | |
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Title:
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METHOD FOR DEBONDING TEMPORARILY ADHESIVE-BONDED CARRIER-WORKPIECE PAIR BY USING HIGH PRESSURE SOLVENT
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Patent #:
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Issue Dt:
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09/24/2019
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Application #:
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15934080
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Filing Dt:
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03/23/2018
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Publication #:
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Pub Dt:
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08/15/2019
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Title:
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MULTIPLE WAFERS FABRICATION TECHNIQUE ON LARGE CARRIER WITH WARPAGE CONTROL STIFFENER
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Patent #:
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NONE
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Issue Dt:
|
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Application #:
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15934700
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Filing Dt:
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03/23/2018
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Publication #:
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Pub Dt:
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08/22/2019
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Title:
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GLASS FRAME FAN OUT PACKAGING AND METHOD OF MANUFACTURING THEREOF
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Patent #:
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Issue Dt:
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07/09/2019
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Application #:
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15940878
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Filing Dt:
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03/29/2018
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Title:
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MOLDED CAVITY FANOUT PACKAGE WITHOUT USING A CARRIER AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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Issue Dt:
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08/04/2020
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Application #:
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15957831
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Filing Dt:
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04/19/2018
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Publication #:
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Pub Dt:
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08/15/2019
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Title:
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HERMETIC FLAT TOP INTEGRATED HEAT SPREADER (IHS) / ELECTROMAGNETIC INTERFERENCE (EMI) SHIELD PACKAGE AND METHOD OF MANUFACTURING THEREOF FOR REDUCING WARPAGE
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Patent #:
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|
Issue Dt:
|
02/19/2019
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Application #:
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15958797
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Filing Dt:
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04/20/2018
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Title:
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SYSTEM AND METHOD OF EMBEDDING DRIVER IC (EmDIC) IN LCD DISPLAY SUBSTRATE
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Patent #:
|
|
Issue Dt:
|
02/19/2019
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Application #:
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15959125
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Filing Dt:
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04/20/2018
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Title:
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SYSTEM AND METHOD OF MANUFACTURING FRAMELESS LCD DISPLAY
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Patent #:
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Issue Dt:
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11/16/2021
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Application #:
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15964576
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Filing Dt:
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04/27/2018
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Publication #:
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Pub Dt:
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09/26/2019
| | | | |
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Title:
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METHOD OF DEBONDING WORK-CARRIER PAIR WITH THIN DEVICES
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Patent #:
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Issue Dt:
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03/15/2022
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Application #:
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16297394
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Filing Dt:
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03/08/2019
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Publication #:
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Pub Dt:
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09/12/2019
| | | | |
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Title:
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ADHESIVE COMPOSITION FOR TEMPORARY BONDING OF SEMICONDUCTOR WORKPIECE AND SUPPORT CARRIER PAIR
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Patent #:
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NONE
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Issue Dt:
|
|
Application #:
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16817388
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Filing Dt:
|
03/12/2020
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|
Publication #:
|
|
Pub Dt:
|
09/16/2021
| | | | |
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Title:
|
EMBEDDED MOLDING FAN-OUT (EMFO) PACKAGING AND METHOD OF MANUFACTURING THEREOF
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|
|
|
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Patent #:
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NONE
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Issue Dt:
|
11/01/2022
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Application #:
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16971412
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Filing Dt:
|
08/20/2020
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|
Publication #:
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Pub Dt:
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08/05/2021
| | |
PCT #:
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IB2019000312
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Title:
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ENCAPSULATED FAN-IN SEMICONDUCTOR PACKAGE WITH HEAT SPREADER AND METHOD OF MANUFACTURING THE SAME
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|
|
|
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Patent #:
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NONE
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Issue Dt:
|
|
Application #:
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17207914
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Filing Dt:
|
03/22/2021
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Publication #:
|
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Pub Dt:
|
09/22/2022
| | | | |
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Title:
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INTERPOSER STRUCTURE CONTAINING EMBEDDED SILICON-LESS LINK CHIPLET
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|
