Patent Assignment Details
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| Reel/Frame: | 031003/0717 | |
| Pages: | 6 |
| | Recorded: | 08/12/2013 | | |
| Attorney Dkt #: | 092977B1C3 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE SPELLING OF INVENTOR MIN-TA LEI NEEDS TO BE CORRECTED TO MING-TA LEI PREVIOUSLY RECORDED ON REEL 030764 FRAME 0930. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/08/2011
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Application #:
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11981138
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Filing Dt:
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10/31/2007
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Publication #:
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Pub Dt:
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03/20/2008
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Title:
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A STRUCTURE AND MANUFACTURING METHOD OF A CHIP SCALE PACKAGE WITH LOW FABRICATION COST, FINE PITCH AND HIGH RELIABILITY SOLDER BUMP
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Assignee
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| 21 R&D FIRST ROAD |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN ROC |
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Correspondence name and address
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QUALCOMM INCORPORATED
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5775 MOREHOUSE DRIVE
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SAN DIEGO, CA 92121-1714
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