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Total properties:
27
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Patent #:
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Issue Dt:
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12/08/1992
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Application #:
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07256017
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Filing Dt:
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10/11/1988
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Title:
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POST-TERMINATION APPARATUS AND PROCESS FOR THICK FILM RESISTORS OF PRINTED CIRCUIT BOARDS
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Patent #:
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Issue Dt:
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09/29/1992
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Application #:
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07422395
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Filing Dt:
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10/16/1989
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Title:
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AN INTERFACE DEVICE FOR THERMALLY COUPLING AN INTEGRATED CIRCUIT TO A HEAT SINK
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Patent #:
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Issue Dt:
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11/17/1992
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Application #:
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07724011
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Filing Dt:
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07/01/1991
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Title:
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POST-TERMINATION APPARATUS AND PROCESS FOR THICK FILM RESISTORS OF PRINTED CIRCUIT BOARDS
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Patent #:
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Issue Dt:
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03/07/1995
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Application #:
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08038379
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Filing Dt:
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03/29/1993
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Title:
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ULTRA-THICK THICK FILMS FOR THERMAL MANAGEMENT AND CURRENT CARRYING CAPABILITIES IN HYBRID CIRCUITS
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Patent #:
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Issue Dt:
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10/10/1995
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Application #:
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08038422
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Filing Dt:
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03/29/1993
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Title:
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THICK FILM ROTATIONAL ACCELEROMETER HAVING TWO STRUCTURALLY INTEGRATED ACCELERATION SENSORS
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Patent #:
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Issue Dt:
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06/18/1996
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Application #:
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08342966
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Filing Dt:
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11/21/1994
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Title:
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INK COMPOSITION FOR AN ULTRA-THICK THICK FILM FOR THERMAL MANAGEMENT OF A HYBRID CIRCUIT
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Patent #:
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Issue Dt:
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06/18/1996
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Application #:
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08391740
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Filing Dt:
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02/21/1995
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Title:
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MULTILAYER CONDUCTOR FOR PRINTED CIRCUITS
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Patent #:
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Issue Dt:
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04/15/1997
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Application #:
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08523580
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Filing Dt:
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09/05/1995
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Title:
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SEGMENTED THICK FILM RESISTORS
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Patent #:
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Issue Dt:
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02/10/1998
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Application #:
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08668900
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Filing Dt:
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06/24/1996
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Title:
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THICK-FILM CONDUCTOR COMPOSITIONS COMPRISING SILVER OR PALLADIUM PARTICLES COATED WITH ALUMINA OR ZIRCONIA
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Patent #:
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Issue Dt:
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07/20/1999
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Application #:
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08887064
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Filing Dt:
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07/02/1997
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Title:
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METHOD FOR CONTROLLING SOLDER BUMP SHAPE AND STAND-OFF HEIGHT
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Patent #:
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Issue Dt:
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02/09/1999
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Application #:
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08954266
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Filing Dt:
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10/20/1997
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Title:
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METHOD OF MAKING A THICK FILM PRESSURE SENSOR
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Patent #:
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Issue Dt:
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07/27/1999
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Application #:
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08954385
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Filing Dt:
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10/20/1997
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Title:
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THICK FILM CIRCUIT HAVING IMPROVED CONDUCTOR COMPOSITON WITH COATED METALLIC PARTICLES
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Patent #:
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Issue Dt:
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10/05/1999
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Application #:
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08985436
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Filing Dt:
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12/05/1997
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Title:
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METHOD FOR CONTROLLING SOLDERABILITY OF A CONDUCTOR AND CONDUCTOR FORMED THEREBY
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Patent #:
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Issue Dt:
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06/08/1999
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Application #:
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08991685
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Filing Dt:
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12/16/1997
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Title:
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METHOD OF MANUFACTURE FOR A THICK FILM MULTI-LAYER CIRCUIT
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Patent #:
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Issue Dt:
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04/27/1999
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Application #:
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08994113
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Filing Dt:
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12/19/1997
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Title:
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DIFFUSION-BARRIER MATERIALS FOR THICK-FILM PIEZORESISTORS AND SENSORS FORMED THEREWITH
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Patent #:
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Issue Dt:
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09/28/1999
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Application #:
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08995801
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Filing Dt:
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12/22/1997
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Title:
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STRAIN GAUGE WITH STEEL SUBSTRATE
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Patent #:
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Issue Dt:
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03/11/2003
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Application #:
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09016504
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Filing Dt:
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01/30/1998
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Title:
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SOLDER STOP FOR AN ELECTRICAL CONNECTION AND METHOD THEREFOR
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Patent #:
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Issue Dt:
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12/28/1999
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Application #:
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09106788
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Filing Dt:
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06/29/1998
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Title:
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METHOD OF MANUFACTURING A THICK FILM CIRCUIT WITH IMPROVED DIELECTRIC FEATURE DEFINITION
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|
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Patent #:
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Issue Dt:
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02/08/2000
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Application #:
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09127291
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Filing Dt:
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07/31/1998
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Title:
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METAL DIAPHRAGM SENSOR WITH POLYSILICON SENSING ELEMENTS AND METHODS THEREFOR
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Patent #:
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Issue Dt:
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01/30/2001
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Application #:
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09178758
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Filing Dt:
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10/26/1998
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Title:
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METHOD OF FORMING RUTHENIUM-BASED THICK-FILM RESISTORS
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Patent #:
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Issue Dt:
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05/22/2001
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Application #:
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09232951
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Filing Dt:
|
01/17/1999
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Title:
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METHOD OF FORMING THICK-FILM HYBRID CIRCUIT ON A METAL CIRCUIT BOARD
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|
|
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Patent #:
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Issue Dt:
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12/11/2001
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Application #:
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09240084
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Filing Dt:
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01/29/1999
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Title:
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THICK-FILM PASTE WITH INSOLUBLE ADDITIVE
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Patent #:
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Issue Dt:
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11/21/2000
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Application #:
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09344046
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Filing Dt:
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06/25/1999
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|
Title:
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THICK-FILM CIRCUITS AND METALLIZATION PROCESS
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|
|
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Patent #:
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|
Issue Dt:
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05/21/2002
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Application #:
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09344971
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Filing Dt:
|
06/28/1999
|
|
Title:
|
METHOD FOR CONTROLLING SOLDERABILITY OF A CONDUCTOR AND CONDUCTOR FORMED THEREBY
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|
|
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Patent #:
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|
Issue Dt:
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12/26/2000
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Application #:
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09384892
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Filing Dt:
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08/27/1999
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|
Title:
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METHOD OF MANUFACTURING A THICK FILM CIRCUIT WITH CONSTRAINED ADHESIVE SPREADING
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|
|
|
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Patent #:
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Issue Dt:
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04/24/2001
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Application #:
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09385051
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Filing Dt:
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08/30/1999
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Title:
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HIGH CURRENT CIRCUIT TRACE AND COMPOSITION AND METHOD THEREFOR
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|
|
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Patent #:
|
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Issue Dt:
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03/26/2002
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Application #:
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09467500
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Filing Dt:
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12/20/1999
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Title:
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MULTI-LAYER CONDUCTOR PAD FOR REDUCING SOLDER Voiding
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