Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 050774/0722 | |
| Pages: | 5 |
| | Recorded: | 10/21/2019 | | |
| Attorney Dkt #: | 2013-0604/24061.2580US03 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/15/2021
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Application #:
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16658355
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Filing Dt:
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10/21/2019
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Publication #:
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Pub Dt:
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02/13/2020
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Title:
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Dual Facing BSI Image Sensors with Wafer Level Stacking
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Assignee
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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Correspondence name and address
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HAYNES AND BOONE, LLP IP SECTION
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2323 VICTORY AVENUE
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SUITE 700
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DALLAS, TX 75219
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