Patent Assignment Details
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Reel/Frame: | 013498/0724 | |
| Pages: | 2 |
| | Recorded: | 11/15/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/15/2011
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Application #:
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10295281
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Filing Dt:
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11/15/2002
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Publication #:
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Pub Dt:
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05/15/2003
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Title:
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WAFER-LEVEL CHIP SCALE PACKAGE HAVING STUD BUMP AND METHOD FOR FABRICATING THE SAME
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Assignee
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82-3, DODANG-DONG, WONMI-KU |
BUCHEON CITY, KYONGGI-DO 420-711, KOREA, REPUBLIC OF |
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Correspondence name and address
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RADER, FISHMAN & GRAUER
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KENNETH E. HORTON
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RIVER PARK CORPORATE CENTER ONE
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10653 S. RIVER FRONT PARKWAY, SUITE 150
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SOUTH JORDAN, UTAH 84095
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