Patent Assignment Details
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Reel/Frame: | 023793/0726 | |
| Pages: | 4 |
| | Recorded: | 01/15/2010 | | |
Attorney Dkt #: | TW-GNA-0758DIV |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/29/2011
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Application #:
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12635388
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Filing Dt:
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12/10/2009
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Publication #:
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Pub Dt:
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04/08/2010
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Title:
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DIE REARRANGEMENT PACKAGE STRUCTURE USING LAYOUT PROCESS TO FORM A COMPLIANT CONFIGURATION
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Assignees
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NO.1. R&D RD.1, SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU CITY, TAIWAN |
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CANON'S COURT, 22 VICTORIA STREET |
HAMILTON, BERMUDA HM 12 |
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Correspondence name and address
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MING CHOW
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2275 RESEARCH BLVD.
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SUITE 500
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ROCKVILLE, MD 20850
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