Patent Assignment Details
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Reel/Frame: | 047715/0726 | |
| Pages: | 3 |
| | Recorded: | 12/09/2018 | | |
Attorney Dkt #: | 82429-US-1134-PCT |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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11/22/2022
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Application #:
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16087087
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Filing Dt:
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12/09/2018
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Publication #:
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Pub Dt:
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07/22/2021
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Title:
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Bonding apparatus including a heater and a cooling flow path used for stacking a plurality of semiconductor chips
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Assignee
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51-1 INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI, |
TOKYO, JAPAN 208-8585 |
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Correspondence name and address
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JCIPRNET
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P.O. BOX 600 TAIPEI GUTING
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TAIPEI CITY, 10099 TAIWAN
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