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Reel/Frame:019950/0731   Pages: 4
Recorded: 10/12/2007
Attorney Dkt #:MEGA 07-011US-TW06015-E05
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
09/20/2011
Application #:
11864935
Filing Dt:
09/29/2007
Publication #:
Pub Dt:
04/03/2008
Title:
INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL
Assignors
1
Exec Dt:
10/09/2007
2
Exec Dt:
10/09/2007
3
Exec Dt:
10/09/2007
Assignee
1
ROOM 301/302,NO.47, PARK 2ND RD., SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN 300
Correspondence name and address
JOHN CHEN
ROOM 303, 3F., NO. 25, SEC.1,
CHANG-AN E. ROAD,
TAIPEI, 10441 TAIWAN

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