Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 062933/0732 | |
| Pages: | 12 |
| | Recorded: | 03/09/2023 | | |
| Attorney Dkt #: | 411239-US-NP |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17725422
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Filing Dt:
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04/20/2022
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Publication #:
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Pub Dt:
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10/26/2023
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Title:
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3D INTEGRATED CHIPS WITH MICROFLUIDIC COOLING
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Assignee
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| ONE MICROSOFT WAY |
| REDMOND, WASHINGTON 98052 |
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Correspondence name and address
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RAY QUINNEY & NEBEKER - MICROSOFT
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36 SOUTH STATE STREET
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SUITE 1400
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SALT LAKE CITY, UT 84111
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05/26/2024 01:02 AM
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