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Patent Assignment Details
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Reel/Frame:067376/0737   Pages: 5
Recorded: 05/10/2024
Attorney Dkt #:814063.433
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
18156976
Filing Dt:
01/19/2023
Publication #:
Pub Dt:
08/03/2023
Title:
MANUFACTURING PROCESS OF AN OHMIC CONTACT OF A HEMT DEVICE AND HEMT DEVICE
Assignor
1
Exec Dt:
02/02/2024
Assignee
1
VIA C. OLIVETTI, 2
AGRATE BRIANZA, ITALY 20864
Correspondence name and address
TESSA MCCLURE
SEED IP LAW GROUP LLP
701 FIFTH AVENUE, SUITE 5400
SEATTLE, WA 98104

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