Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 057510/0739 | |
| Pages: | 10 |
| | Recorded: | 09/17/2021 | | |
| Attorney Dkt #: | 28744-5413 (171010.5) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
3
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Patent #:
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Issue Dt:
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03/05/2024
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Application #:
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17447519
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Filing Dt:
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09/13/2021
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Publication #:
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Pub Dt:
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03/17/2022
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Title:
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CLEAVED SEMICONDUCTOR WAFER CAMERA SYSTEM
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17447524
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Filing Dt:
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09/13/2021
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Publication #:
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Pub Dt:
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03/17/2022
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Title:
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CLEAVED SEMICONDUCTOR WAFER IMAGING SYSTEM
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17447527
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Filing Dt:
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09/13/2021
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Publication #:
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Pub Dt:
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03/17/2022
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Title:
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METHOD OF PROCESSING A CLEAVED SEMICONDUCTOR WAFER
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Assignee
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| NO. 8. INDUSTRIAL EAST ROAD |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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Correspondence name and address
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PATENT DOCKET DEPARTMENT ARMSTRONG TEASDALE LLP
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7700 FORSYTH BOULEVARD
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SUITE 1800
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ST. LOUIS, MO 63105
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06/03/2024 06:56 AM
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