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Patent Assignment Details
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Reel/Frame:021794/0741   Pages: 5
Recorded: 11/07/2008
Attorney Dkt #:022234-9001
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 5
1
Patent #:
Issue Dt:
12/07/2004
Application #:
09963899
Filing Dt:
09/26/2001
Publication #:
Pub Dt:
03/27/2003
Title:
MODULAR COOLING SYSTEM AND THERMAL BUS FOR HIGH POWER ELECTRONICS CABINETS
2
Patent #:
Issue Dt:
03/28/2006
Application #:
10739759
Filing Dt:
12/18/2003
Publication #:
Pub Dt:
06/23/2005
Title:
FORCED FLUID HEAT SINK
3
Patent #:
Issue Dt:
08/05/2008
Application #:
10921527
Filing Dt:
08/19/2004
Publication #:
Pub Dt:
02/23/2006
Title:
BONDED SILICON, COMPONENTS AND A METHOD OF FABRICATING THE SAME
4
Patent #:
NONE
Issue Dt:
Application #:
11264406
Filing Dt:
11/01/2005
Publication #:
Pub Dt:
05/03/2007
Title:
Vapor compression cooling system for cooling electronics
5
Patent #:
Issue Dt:
12/25/2007
Application #:
11266812
Filing Dt:
11/04/2005
Publication #:
Pub Dt:
05/10/2007
Title:
COOLING SYSTEM FOR COMPUTER ELECTRONICS
Assignor
1
Exec Dt:
04/29/2008
Assignee
1
RT. 113 & EDWARD STREET
GEORGETOWN, DELAWARE 19947
Correspondence name and address
STEPHEN A. GIGOT, ESQ.
100 EAST WISCONSIN AVENUE, SUITE 3300
MICHAEL BEST & FRIEDRICH LLP
MILWAUKEE, WI 53202-4108

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