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Patent Assignment Details
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Reel/Frame:024785/0742   Pages: 7
Recorded: 08/04/2010
Conveyance: CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Total properties: 3
1
Patent #:
Issue Dt:
09/29/1998
Application #:
08660490
Filing Dt:
06/07/1996
Title:
SEMICONDUCTOR DIE WITH STAGGERED BOND PADS
2
Patent #:
Issue Dt:
08/18/1998
Application #:
08712981
Filing Dt:
09/16/1996
Title:
PROGRESSIVE STAGGERED BONDING PADS
3
Patent #:
Issue Dt:
02/03/2004
Application #:
10295711
Filing Dt:
11/15/2002
Title:
GROUND PLANE ON 2 LAYER PBGA
Assignor
1
Exec Dt:
04/05/2007
Assignee
1
1621 BARBER LANE
MS: D-105 LEGAL
MILPITAS, CALIFORNIA 95035
Correspondence name and address
LSI CORPORATION
1621 BARBER LANE
MS: D-105 LEGAL
MILPITAS, CA 95035

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