Patent Assignment Details
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| Reel/Frame: | 055746/0742 | |
| Pages: | 5 |
| | Recorded: | 03/29/2021 | | |
| Attorney Dkt #: | TSMCP1174US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/13/2024
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Application #:
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17088805
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Filing Dt:
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11/04/2020
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Publication #:
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Pub Dt:
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06/24/2021
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Title:
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INTEGRATED ALIGNED STEALTH LASER WITH BLADE AND GRINDING APPARATUS FOR WAFER EDGE TRIMMING PROCESS
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Assignee
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| NO. 8, LI-HSIN RD. 6 |
| HSIN-CHU SCIENCE PARK |
| HSIN-CHU, TAIWAN 300-77 |
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Correspondence name and address
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ESCHWEILER & POTASHNIK, LLC
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ROSETTA CENTER
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629 EUCLID AVE., SUITE 1000
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CLEVELAND, OH 44114
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05/30/2024 06:37 AM
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