Patent Assignment Details
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| Reel/Frame: | 012730/0744 | |
| Pages: | 6 |
| | Recorded: | 04/03/2002 | | |
| Conveyance: | DOCUMENT RE-RECORDED TO CORRECT AN ERROR CONTAINED IN SERIAL NO. 09/594,330. PREVIOUSLY RECORDED AT REEL 011221, FRAME 0564. |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/11/2003
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Application #:
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09594329
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Filing Dt:
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06/15/2000
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Title:
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METHOD FOR REDUCING MOLD DEPOSIT FORMATION DURING MOLDING OF POLYAMIDES AND COMPOSITION THEREFOR
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Assignee
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| LAW DEPARTMENT, MAIL CODE 1907A |
| 200 EAST RANDOLPH DRIVE, P.O. BOX 87703 |
| CHICAGO, ILLINOIS 60680 |
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Correspondence name and address
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MCDERMOTT, WILL & EMERY
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BERNARD P. CODD
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600 13TH STREET, N.W.
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WASHINGTON, DC 20005
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