Patent Assignment Details
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| Reel/Frame: | 020443/0747 | |
| Pages: | 2 |
| | Recorded: | 01/17/2008 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12007977
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Filing Dt:
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01/17/2008
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Publication #:
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Pub Dt:
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04/02/2009
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Title:
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Wafer-level image sensor module, method of manufacturing the same, and camera module
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Assignee
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| 314, MAETAN 3-DONG, YEONGTONG-GU |
| SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF 443-743 |
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Correspondence name and address
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STAAS & HALSEY, LLP
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ATTN: DAVID M. PITCHER
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1201 NEW YORK AVENUE, N.W., SUITE 700
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WSAHINGTONG, D.C. 20005
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