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Reel/Frame:034597/0747   Pages: 7
Recorded: 12/30/2014
Attorney Dkt #:3570-315
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
08/16/2016
Application #:
14411843
Filing Dt:
12/29/2014
Publication #:
Pub Dt:
07/09/2015
Title:
PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, DRY FILM SOLDER RESIST MANUFACTURED THEREFROM, AND CIRCUIT BOARD INCLUDING THE SOLDER RESIST
Assignors
1
Exec Dt:
10/16/2014
2
Exec Dt:
10/16/2014
3
Exec Dt:
10/16/2014
4
Exec Dt:
10/16/2014
5
Exec Dt:
10/17/2014
6
Exec Dt:
10/16/2014
Assignee
1
128, YEOUI-DAERO, YEONGDEUNGPO-GU
SEOUL, KOREA, REPUBLIC OF 150-721
Correspondence name and address
ROTHWELL, FIGG, ERNST & MANBECK, P.C.
607 14TH STREET, N.W.; SUITE 800
WASHINGTON, DC 20005

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