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Reel/Frame:054575/0747   Pages: 3
Recorded: 12/02/2020
Attorney Dkt #:6495-1139WOUS
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
17041689
Filing Dt:
09/25/2020
Publication #:
Pub Dt:
01/14/2021
Title:
METHOD OF ASSEMBLING A SEMICONDUCTOR POWER MODULE COMPONENT AND A SEMICONDUCTOR POWER MODULE WITH SUCH A MODULE COMPONENT AND MANUFACTURING SYSTEM THEREFOR
Assignors
1
Exec Dt:
09/09/2020
2
Exec Dt:
08/25/2020
Assignee
1
HUSUMER STRASSE 251
FLENSBURG, GERMANY 24941
Correspondence name and address
MARINA F. CUNNINGHAM MCCORMICK PAULDING & HUBER
185 ASYLUM STREET, CITYPLACE II, 18TH FL
6495-1139WOUS
HARTFORD, CT 06103-3410

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