Patent Assignment Details
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| Reel/Frame: | 059764/0747 | |
| Pages: | 5 |
| | Recorded: | 04/28/2022 | | |
| Attorney Dkt #: | 078697.00480 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/24/2023
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Application #:
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17356473
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Filing Dt:
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06/23/2021
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Publication #:
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Pub Dt:
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03/10/2022
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Title:
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BINNING-ENHANCED DEFECT DETECTION METHOD FOR THREE-DIMENSIONAL WAFER STRUCTURES
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Assignee
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| ONE TECHNOLOGY DRIVE |
| MILPITAS, CALIFORNIA 95035 |
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Correspondence name and address
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HODGSON RUSS LLP
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140 PEARL STREET
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SUITE 100
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BUFFALO, NY 14202
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05/28/2024 02:18 PM
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