Patent Assignment Details
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Reel/Frame: | 046400/0748 | |
| Pages: | 3 |
| | Recorded: | 07/19/2018 | | |
Attorney Dkt #: | HT18-014 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/31/2019
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Application #:
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16008650
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Filing Dt:
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06/14/2018
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Publication #:
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Pub Dt:
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12/19/2019
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Title:
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Under-Cut Via Electrode for Sub 60nm Etchless MRAM Devices by Decoupling the Via Etch Process
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Assignee
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678 S. HILLVIEW DRIVE |
MILPITAS, CALIFORNIA 95035 |
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Correspondence name and address
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SAILE ACKERMAN LLC
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28 DAVIS AVENUE
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POUGHKEEPSIE, NY 12603
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05/30/2024 09:18 AM
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