Patent Assignment Details
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| Reel/Frame: | 011935/0754 | |
| Pages: | 4 |
| | Recorded: | 09/07/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09682481
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Filing Dt:
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09/07/2001
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Publication #:
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Pub Dt:
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09/05/2002
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Title:
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Method of forming a via of a dual damascene with low resistance
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Assignee
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| NO.16, LI-HSIN RD, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN, R.O.C. |
| NO.16, LI-HSIN RD, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, TAIWAN, R.O.C. |
| HSIN-CHU, TAIWAN |
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Correspondence name and address
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WINSTON HSU
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SF. 389, FU-HO ROAD
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YUNGHO CITY, TAIPEI, TAIWAN
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