Patent Assignment Details
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| Reel/Frame: | 055692/0754 | |
| Pages: | 8 |
| | Recorded: | 03/23/2021 | | |
| Attorney Dkt #: | H-314 (FP1090060) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/06/2023
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Application #:
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17210452
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Filing Dt:
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03/23/2021
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Publication #:
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Pub Dt:
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05/26/2022
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Title:
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STACKED SEMICONDUCTOR PACKAGE AND PACKAGING METHOD THEREOF
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Assignee
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| NO.10, DATONG RD. |
| HUKOU TOWNSHIP, HSINCHU COUNTY, TAIWAN 30352 |
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Correspondence name and address
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PATENTTM.US JAMES H. WALTERS
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205 SE SPOKANE ST STE 300
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PORTLAND, OR 97202-6487
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06/04/2024 02:10 AM
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