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Patent Assignment Details

NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:	049350/0756			Pages:	8
		Recorded:	06/03/2019
Conveyance:	ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 233
Page 3 of 3
Pages: 1 2 3

Patent #:	10770416	Issue Dt:	09/08/2020	Application #:	16282980	Filing Dt:	02/22/2019
Publication #:	US20200075517	Pub Dt:	03/05/2020
Title:	SEMICONDUCTOR PACKAGE

Patent #:	10685916	Issue Dt:	06/16/2020	Application #:	16285596	Filing Dt:	02/26/2019
Publication #:	US20200075487	Pub Dt:	03/05/2020
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	11075175	Issue Dt:	07/27/2021	Application #:	16285606	Filing Dt:	02/26/2019
Publication #:	US20200051933	Pub Dt:	02/13/2020
Title:	SEMICONDUCTOR PACKAGE

Patent #:	10938090	Issue Dt:	03/02/2021	Application #:	16287056	Filing Dt:	02/27/2019
Publication #:	US20200014090	Pub Dt:	01/09/2020
Title:	ANTENNA MODULE

Patent #:	10811379	Issue Dt:	10/20/2020	Application #:	16287064	Filing Dt:	02/27/2019
Publication #:	US20200013743	Pub Dt:	01/09/2020
Title:	SEMICONDUCTOR PACKAGE

Patent #:	10854585	Issue Dt:	12/01/2020	Application #:	16287372	Filing Dt:	02/27/2019
Publication #:	US20200027864	Pub Dt:	01/23/2020
Title:	SEMICONDUCTOR PACKAGE WITH IMPROVED POWER INTEGRITY

Patent #:	11201108	Issue Dt:	12/14/2021	Application #:	16291060	Filing Dt:	03/04/2019
Publication #:	US20200035589	Pub Dt:	01/30/2020
Title:	SEMICONDUCTOR PACKAGE MOUNTED SUBSTRATE

Patent #:	11177551	Issue Dt:	11/16/2021	Application #:	16291594	Filing Dt:	03/04/2019
Publication #:	US20200028239	Pub Dt:	01/23/2020
Title:	ANTENNA MODULE

Patent #:	10790255	Issue Dt:	09/29/2020	Application #:	16291621	Filing Dt:	03/04/2019
Publication #:	US20200105703	Pub Dt:	04/02/2020
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	NONE	Issue Dt:		Application #:	16293221	Filing Dt:	03/05/2019
Publication #:	US20200027833	Pub Dt:	01/23/2020
Title:	Electronic Component Package

Patent #:	11380636	Issue Dt:	07/05/2022	Application #:	16293239	Filing Dt:	03/05/2019
Publication #:	US20200083184	Pub Dt:	03/12/2020
Title:	Semiconductor Package

Patent #:	10756030	Issue Dt:	08/25/2020	Application #:	16293301	Filing Dt:	03/05/2019
Publication #:	US20200051928	Pub Dt:	02/13/2020
Title:	SEMICONDUCTOR PACKAGE

Patent #:	11011485	Issue Dt:	05/18/2021	Application #:	16294083	Filing Dt:	03/06/2019
Publication #:	US20200091099	Pub Dt:	03/19/2020
Title:	SEMICONDUCTOR PACKAGE

Patent #:	10886246	Issue Dt:	01/05/2021	Application #:	16351784	Filing Dt:	03/13/2019
Publication #:	US20200035632	Pub Dt:	01/30/2020
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	NONE	Issue Dt:		Application #:	16353184	Filing Dt:	03/14/2019
Publication #:	US20190345323	Pub Dt:	11/14/2019
Title:	RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND INTEGRATED CIRCUIT PACKAGE, AND PRODUCT USING THE SAME

Patent #:	NONE	Issue Dt:		Application #:	16354931	Filing Dt:	03/15/2019
Publication #:	US20190345325	Pub Dt:	11/14/2019
Title:	RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND INTEGRATED CIRCUIT PACKAGE, AND PRODUCT USING THE SAME

Patent #:	10741498	Issue Dt:	08/11/2020	Application #:	16357783	Filing Dt:	03/19/2019
Publication #:	US20200020638	Pub Dt:	01/16/2020
Title:	SEMICONDUCTOR PACKAGE

Patent #:	10825778	Issue Dt:	11/03/2020	Application #:	16371653	Filing Dt:	04/01/2019
Publication #:	US20200105679	Pub Dt:	04/02/2020
Title:	SEMICONDUCTOR PACKAGE HAVING MARK WITH IDENTIFICATION INFORMATION

Patent #:	10636743	Issue Dt:	04/28/2020	Application #:	16375302	Filing Dt:	04/04/2019
Publication #:	US20190229060	Pub Dt:	07/25/2019
Title:	ELECTRONIC COMPONENT PACKAGE AND MANUFACTURING METHOD OF THE SAME

Patent #:	11164838	Issue Dt:	11/02/2021	Application #:	16388004	Filing Dt:	04/18/2019
Publication #:	US20200266167	Pub Dt:	08/20/2020
Title:	SEMICONDUCTOR PACKAGE INCLUDING PLURALITY OF SEMICONDUCTOR CHIPS ON COMMON CONNECTION STRUCTURE

Patent #:	NONE	Issue Dt:		Application #:	16392858	Filing Dt:	04/24/2019
Publication #:	US20190345326	Pub Dt:	11/14/2019
Title:	LOW-LOSS INSULATING RESIN COMPOSITION AND INSULATING FILM USING THE SAME

Patent #:	11127692	Issue Dt:	09/21/2021	Application #:	16393073	Filing Dt:	04/24/2019
Publication #:	US20200168562	Pub Dt:	05/28/2020
Title:	SEMICONDUCTOR PACKAGE

Patent #:	10790224	Issue Dt:	09/29/2020	Application #:	16399540	Filing Dt:	04/30/2019
Publication #:	US20190259697	Pub Dt:	08/22/2019
Title:	CARRIER SUBSTRATE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME

Patent #:	10847474	Issue Dt:	11/24/2020	Application #:	16403968	Filing Dt:	05/06/2019
Title:	SEMICONDUCTOR PACKAGE AND ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURE FOR THE SAME

Patent #:	10811352	Issue Dt:	10/20/2020	Application #:	16405693	Filing Dt:	05/07/2019
Publication #:	US20200105665	Pub Dt:	04/02/2020
Title:	SEMICONDUCTOR PACKAGE

Patent #:	10847476	Issue Dt:	11/24/2020	Application #:	16406951	Filing Dt:	05/08/2019
Publication #:	US20200168565	Pub Dt:	05/28/2020
Title:	SEMICONDUCTOR PACKAGE

Patent #:	10872860	Issue Dt:	12/22/2020	Application #:	16407561	Filing Dt:	05/09/2019
Publication #:	US20200144183	Pub Dt:	05/07/2020
Title:	SEMICONDUCTOR PACKAGE

Patent #:	10903548	Issue Dt:	01/26/2021	Application #:	16410853	Filing Dt:	05/13/2019
Publication #:	US20200185815	Pub Dt:	06/11/2020
Title:	ANTENNA MODULE

Patent #:	10930593	Issue Dt:	02/23/2021	Application #:	16413039	Filing Dt:	05/15/2019
Publication #:	US20200294917	Pub Dt:	09/17/2020
Title:	PACKAGE ON PACKAGE AND PACKAGE CONNECTION SYSTEM COMPRISING THE SAME

Patent #:	10818604	Issue Dt:	10/27/2020	Application #:	16414016	Filing Dt:	05/16/2019
Publication #:	US20200303314	Pub Dt:	09/24/2020
Title:	SEMICONDUCTOR PACKAGE

Patent #:	11043449	Issue Dt:	06/22/2021	Application #:	16418861	Filing Dt:	05/21/2019
Publication #:	US20200168544	Pub Dt:	05/28/2020
Title:	SEMICONDUCTOR PACKAGE

Patent #:	NONE	Issue Dt:		Application #:	16418865	Filing Dt:	05/21/2019
Publication #:	US20200105694	Pub Dt:	04/02/2020
Title:	OPEN PAD STRUCTURE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME

Patent #:	11075193	Issue Dt:	07/27/2021	Application #:	16418885	Filing Dt:	05/21/2019
Publication #:	US20200144235	Pub Dt:	05/07/2020
Title:	SEMICONDUCTOR PACKAGE

Assignor

SAMSUNG ELECTRO-MECHANICS CO., LTD.

Exec Dt:

06/01/2019

Assignee

SAMSUNG ELECTRONICS CO., LTD.

129, SAMSUNG-RO, YEONGTONG-GU

SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF

Correspondence name and address
	MORGAN LEWIS & BOCKIUS LLP
	1111 PENNSYLVANIA AVENUE, NW
	WASHINGTON, DC 20004

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