Patent Assignment Details
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Reel/Frame: | 010585/0757 | |
| Pages: | 3 |
| | Recorded: | 01/18/2000 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/23/2001
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Application #:
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09483934
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Filing Dt:
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01/18/2000
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Title:
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Novel Bonding Pad Structure To Prevent Inter-Metal Dielectric Cracking And To Improve Bondability
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Assignee
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121 PARK AVE.3, SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN R.O.C |
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Correspondence name and address
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GEORGE O. SAILE
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20 MCINTOSH DRIVE
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POUGHKEEPSIE, NY 12603
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