Patent Assignment Details
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| Reel/Frame: | 027521/0757 | |
| Pages: | 10 |
| | Recorded: | 01/12/2012 | | |
| Attorney Dkt #: | TI-66653 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE "BEATE BEUERMANN" LISTED UNDER CONVEYING PARTY. HE IS NOT ONE OF THE INVENTORS. PREVIOUSLY RECORDED ON REEL 024487 FRAME 0695. ASSIGNOR(S) HEREBY CONFIRMS THE PATENT (12/729,682) PREVIOUS ASSIGNMENT.. |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/13/2015
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Application #:
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12729682
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Filing Dt:
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03/23/2010
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Publication #:
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Pub Dt:
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09/30/2010
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Title:
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Method of Forming an Electrical Contact Between a Support Wafer and the Surface of a Top Silicon Layer of a Silicon-on-Insulator Wafer and an Electrical Device Including Such an Electrical Contact
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Assignee
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| HAGGERTYSTRASSE 1 |
| FREISING, GERMANY 85356 |
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Correspondence name and address
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TEXAS INSTRUMENTS INCORPORATED
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12500 TI BOULEVARD - M/S 3999
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DALLAS, TX 75243
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